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Products

   Prime and test electronics wafers: (Technical specification)

• surface as cut 2”,3”, 4”, 5” ,6”and 8”                                      
• lapped 2”,3”,4”,5” and 6”
• polished 2”,3”,4”,5” and 6”  (SSP & DSP)
• thin wafers up to 190 micron SSP

    Silicon wafers for solar cells: (Technical specification)

• round wafers 76, 100 ,125 and 150 mm
• pseudosquare:
• 100x100 mm (125 mm, 135 mm)
• 103x103 mm (135 mm, 144 mm) 
• 125x125 mm (150 mm, 165 mm)
• 150x150 mm (195 mm)  

    Epitaxial structures: (Technical specification)

• 76, 100 ,125 and 150 mm up to 100 micron thickness and 100 W*cm resistivity

    High power bipolar and IGBT transistors, diodes Shottky , triac, diac and thyristors (Technical specification)